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DTC123EET1G Просмотр технического описания (PDF) - ON Semiconductor

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DTC123EET1G Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
MUN2231, MMUN2231L, MUN5231, DTC123EE, DTC123EM3, NSBC123EF3
Table 1. ORDERING INFORMATION
Device
Part Marking
Package
Shipping
MUN2231T1G
8H
SC−59
3000 / Tape & Reel
(Pb−Free)
MMUN2231LT1G, NSVMMUN2231LT1G*
A8H
SOT−23
(Pb−Free)
3000 / Tape & Reel
MUN5231T1G
8H
SC−70/SOT−323
3000 / Tape & Reel
(Pb−Free)
DTC123EET1G
8H
SC−75
3000 / Tape & Reel
(Pb−Free)
DTC123EM3T5G, NSVDTC123EM3T5G*
8H
SOT−723
(Pb−Free)
8000 / Tape & Reel
NSBC123EF3T5G
E (180°)**
SOT−1123
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP
Capable.
** (xx°) = Degree rotation in the clockwise direction.
300
250
200
(1) (2) (3) (4) (5)
150
100
(1) SC−75 and SC−70/SOT323; Minimum Pad
(2) SC−59; Minimum Pad
(3) SOT−23; Minimum Pad
(4) SOT−1123; 100 mm2, 1 oz. copper trace
(5) SOT−723; Minimum Pad
50
0
−50 −25
0 25 50 75 100 125 150
AMBIENT TEMPERATURE (°C)
Figure 1. Derating Curve
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