KU80960CF-25(1995) Просмотр технического описания (PDF) - Intel

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KU80960CF-25
(Rev.:1995)

32-BIT HIGH-PERFORMANCE SUPERSCALAR PROCESSOR

Intel 

SPECIAL ENVIRONMENT 80960CF-30 -25 -16

Table 7 Ceramic PGA Package Dimension Symbols

Letter or

Symbol

A

A1

A2

A3

B

D

D1

e1

L

S1

Description of Dimensions

Distance from seating plane to highest point of body

Distance between seating plane and base plane (lid)

Distance from base plane to highest point of body

Distance from seating plane to bottom of body

Diameter of terminal lead pin

Largest overall package dimension of length

A body length dimension outer lead center to outer lead center

Linear spacing between true lead position centerlines

Distance from seating plane to end of lead

Other body dimension outer lead center to edge of body

NOTES

1 Controlling dimension millimeter

2 Dimension ‘‘e1’’ (‘‘e’’) is non-cumulative

3 Seating plane (standoff) is defined by P C board hole size 0 0415 – 0 0430 inch

4 Dimensions ‘‘B’’ ‘‘B1’’ and ‘‘C’’ are nominal

5 Details of Pin 1 identifier are optional

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