CXP86609 Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXP86609

CMOS 8-bit Single Chip Microcomputer

Sony Semiconductor 

Package Outline

Unit: mm

52PIN SDIP (PLASTIC)

+ 0.4

47.0 – 0.1

52

27

1

26

1.778

CXP86609/86613/86617

0° to 15°

0.5 ± 0.1

+ 0.1

0.9 – 0.05

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-52P-01

SDIP052-P-0600

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

COPPER ALLOY

5.6g

– 20 –

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