CXA2013 Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXA2013

EIAJ Sound Multiplexing Decoder

Sony Semiconductor 

Package Outline

Unit: mm

CXA2013M

30PIN SOP (PLASTIC)

+ 0.4

18.8 – 0.1

30

16

+ 0.4

2.3 – 0.15

0.1

+ 0.2

0.1 – 0.05

A

1

0.45 ± 0.1

0.2 M

15

1.27

+ 0.1

0.2 – 0.05

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-30P-L03

SOP030-P-0375

0˚ to 10˚

DETAIL A

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

LEAD MATERIAL

SOLDER PLATING

COPPER ALLOY

PACKAGE MASS

0.7g

LEAD PLATING SPECIFICATIONS

ITEM

LEAD MATERIAL

SOLDER COMPOSITION

PLATING THICKNESS

SPEC.

COPPER ALLOY

Sn-Bi Bi:1-4wt%

5-18µm

– 23 –

Sony Corporation

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