CXA1518S Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXA1518S

EIAJ Sound Multiplexing Decoder

Sony Semiconductor 

Package Outline Unit : mm

CXA1518Q

32PIN QFP (PLASTIC)

24

25

9.0 ± 0.2

+ 0.3

7.0 – 0.1

17

16

0.1

+ 0.35

1.5 – 0.15

32

9

1

8

+ 0.15

0.8 0.3 – 0.1

0.24 M

+ 0.2

0.1 – 0.1

+ 0.1

0.127 – 0.05

0° to 10°

CXA1518S

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-32P-L01

QFP032-P-0707

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

42 ALLOY

0.2g

22PIN SDIP (PLASTIC)

+ 0.4

19.2 – 0.1

22

12

1

11

1.778

0° to 15°

CXA1518Q/S

0.5 ± 0.1

+ 0.15

0.9 – 0.1

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-22P-01

SDIP022-P-0300

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

PACKAGE MASS

COPPER ALLOY

0.95g

—20—

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