25C64 Просмотр технического описания (PDF) - Catalyst Semiconductor => Onsemi

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Компоненты Описание

производитель

25C64

64K-Bit SPI Serial CMOS EEPROM

Catalyst Semiconductor => Onsemi 

CAT25C64

TAPE AND REEL

Direction of Feed

Device Orientation

SPROKET HOLE

EMBOSSED

CARRIER

TOP COVER

TAPE THICKNESS (t1)

0.10mm (0.004) MAX THICK

EMBOSSMENT

DEVICE ORIENTATION

PIN 1

PIN 1

PIN 1

Reel Dimensions(1)

TDFN

SOIC

40mm (1.575) MIN.

T

ACCESS HOLE

AT SLOT LOCATION

B*

A

D*

C

N

FULL RADIUS*

* DRIVE SPOKES OPTIONAL, IF USED

ASTERISKED DIMENSIONS APPLY.

TAPE SLOT IN CORE

FOR TAPE START.

2.5mm (0.098) MIN WIDTH

10mm (0.394) MIN DEPTH

G (MEASURED AT HUB)

TSSOP

Embossed Carrier Dimensions

TAPE

SIZE

A

MAX QTY/REEL

12MM

330

(13.00)

3000

B MIN

1.5

(0.059)

C

12.80 (0.504)

13.20 (0.5200)

D* MIN N MIN

G

T MAX

20.2

50 12.4 (0.488) _18.4_

(0.795) (1.969) 14.4 (0.558) (0.724)

Component/Tape Size Cross-Reference

Component

Package Type

8L SOIC

S, V

Tape Size (W)

12mm

Notes:

(1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses.

Part Pitch (P)

8mm

Doc. No. 1112, Rev. B

12

© 2006 by Catalyst Semiconductor, Inc.

Characteristics subject to change without notice

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