MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
MSOP 8, 3x3
CASE 846AD−01
ISSUE O
DATE 19 DEC 2008
E E1
A A2
A1
TOP VIEW
D
e
b
c
SIDE VIEW
SYMBOL
A
A1
A2
b
c
D
E
E1
e
L
L1
L2
θ
MIN
0.05
0.75
0.22
0.13
2.90
4.80
2.90
0.40
0º
NOM
0.10
0.85
3.00
4.90
3.00
0.65 BSC
0.60
0.95 REF
0.25 BSC
MAX
1.10
0.15
0.95
0.38
0.23
3.10
5.00
3.10
0.80
6º
END VIEW
DETAIL A
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-187.
L
L1
DETAIL A
q
L2
DOCUMENT NUMBER: 98AON34074E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, D20E0S2C−RRIePvT. I0ON: MSOP 8, 3X3
“CONTROLLED COPY” in red.
http://onsemi.com
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Case Outline Number:
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