RF1K49224 Просмотр технического описания (PDF) - Intersil
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RF1K49224 Datasheet PDF : 14 Pages
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RF1K49224
Soldering Precautions
The soldering process creates a considerable thermal stress
on any semiconductor component. The melting temperature
of solder is higher than the maximum rated temperature of
the device. The amount of time the device is heated to a high
temperature should be minimized to assure device reliability.
Therefore, the following precautions should always be
observed in order to minimize the thermal stress to which
the devices are subjected.
1. Always preheat the device.
2. The delta temperature between the preheat and soldering
should always be less than 100oC. Failure to preheat the
device can result in excessive thermal stress which can
damage the device.
3. The maximum temperature gradient should be less than 5oC
per second when changing from preheating to soldering.
4. The peak temperature in the soldering process should be
at least 30oC higher than the melting point of the solder
chosen.
5. The maximum soldering temperature and time must not
exceed 260oC for 10 seconds on the leads and case of
the device.
6. After soldering is complete, the device should be allowed
to cool naturally for at least three minutes, as forced cool-
ing will increase the temperature gradient and may result
in latent failure due to mechanical stress.
7. During cooling, mechanical stress or shock should be
avoided.
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