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BCM5691_

A Scalable Approach to Gigabit Ethernet

Broadcom Corporation 

White Paper

06/27/02

■ BCM567x/BCM569x

INTERCONNECT DECISIONS

For each Gigabit Ethernet switch form factor, designers require GE chips, physical-layer interfaces (including cabling and

connectors), a CPU management system, a power supply, and an operating system for activating and customizing features.

From there, some of the decisions the switch vendor/designer must make include whether the switch should be a single-chip

or multiple-chip solution, this largely depends on the number of ports to be supported. For multiple-chip solutions, designers

must decide what type of interconnect should be used to link the components and pass packets between them.

The choices of interconnects include cascade, matrix, and daisy chain options. StrataXGS cost-effectively supports all these

configurations, which are described in more detail below.

Cascade. This is the simplest interconnect choice, most often used for low-end standalone/fixed systems. In this

configuration, chips are connected in a shared-ring fashion; the transmitter of one module is connected to the receiver of the

next module, and so on. The transmitter of the last module is connected to the receiver of the first module.

The merits of this interconnect choice are that it is the least expensive and uses few resources; ports, backplanes and other

resources are all shared.

One-way

packet flow

BCM5690

BCM5690

BCM5690

Figure 4: A Simplex Interconnect

Document 567x_569x-WP100-R

Broadcom Corporation

What to Build and How to Build It Page 9

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