BAP50LX Просмотр технического описания (PDF) - NXP Semiconductors.
Номер в каталоге
Компоненты Описание
производитель
BAP50LX Datasheet PDF : 10 Pages
| |||
NXP Semiconductors
9 Package outline
DFN1006D-2: Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm
(2x)
L1
(2x)
wA
1
2b
(2x)
(2x)
wB
e
BAP50LX
Silicon PIN diode
SOD882D
y
E
A
A1
A
D
(2)
B
Dimensions
0
Unit
A(1) A1 b
D
E
e L1 w
y
max 0.4 0.04 0.55 0.65 1.05
0.30 0.1 0.03
mm nom
0.50 0.60 1.00 0.65 0.25
min
0.45 0.55 0.95
0.22
Note
1. Dimension including plating thickness.
2. The marking bar indicates the cathode (if applicable).
Outline
version
References
IEC
JEDEC
JEITA
SOD882D
Figure 6. Package outline SOD882D (DFN1006D-2)
0.5
scale
1 mm
European
projection
sod882d_po
Issue date
10-09-27
12-05-01
BAP50LX
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 November 2018
© NXP B.V. 2018. All rights reserved.
6 / 10
Share Link: 