BAP55L Просмотр технического описания (PDF) - Philips Electronics
Номер в каталоге
Компоненты Описание
производитель
BAP55L Datasheet PDF : 8 Pages
| |||
Philips Semiconductors
8. Package outline
Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm
L
L
1
2b
e1
BAP55L
Silicon PIN diode
SOD882
A
A1
E
D
(2)
0
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
A1
max.
b
D
E
e1
L
mm
0.50
0.46
0.03
0.55
0.47
0.62
0.55
1.02
0.95
0.65
0.30
0.22
Notes
1. Including plating thickness
2. The marking bar indicates the cathode
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOD882
Fig 5. Package outline SOD882
9397 750 14811
Preliminary data sheet
Rev. 01 — 5 April 2005
0.5
scale
1 mm
EUROPEAN
PROJECTION
ISSUE DATE
03-04-16
03-04-17
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
5 of 8
Share Link: 