BA14741FJ Просмотр технического описания (PDF) - ROHM Semiconductor

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BA14741FJ

Low Noise Operational Amplifiers

ROHM Semiconductor 

BA14741xx

Datasheet

●Operational Notes

1) Processing of unused circuit

It is recommended to apply connection (see the Figure 33.) and set the

non-inverting input terminal at the potential within input common-mode

voltage range (Vicm), for any unused circuit.

2) Input voltage

Applying VEE to VCC to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, irrespective of

the supply voltage. However, this does not ensure normal circuit

operation. Please note that the circuit operates normally only when the

input voltage is within the common mode input voltage range of the electric

characteristics.

Vicm

Connect

to Vicm

VCC

+

-

VEE

Figure 33. The example of application

circuit for unused op-amp

3) Maximum output voltage

Because the output voltage range becomes narrow as the output current

Increases, design the application with margin by considering changes in

electrical characteristics and temperature characteristics.

4) Short-circuit of output terminal

When output terminal and VCC or VEE terminal are shorted, excessive

Output current may flow under some conditions, and heating may

destroy IC. It is necessary to connect a resistor as shown in Figure 34,

thereby protecting against load shorting.

VCC

protection

+

resistor

-

VEE

5) Power supply (split supply / single supply) in used

Op-amp operates when specified voltage is applied between VCC and

VEE. Therefore, the single supply Op-Amp can be used for double supply

Op-Amp as well.

Figure 34. The example of

output short protection

6) Power dissipation (Pd)

Use a thermal design that allows for a sufficient margin in light of the power

dissipation (Pd) in actual operating conditions.

7) Short-circuit between pins and wrong mounting

Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts

between terminals, GND, or other components on the circuits, can damage the IC.

8) Use in strong electromagnetic field

Using the ICs in strong electromagnetic field can cause operation malfunction.

9) Radiation

This IC is not designed to be radiation-resistant.

10) IC handling

When stress is applied to IC because of deflection or bend of board, the characteristics may

fluctuate due to piezo resistance effects.

11) Inspection on set board

During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not

power up the board without waiting for the output capacitors to discharge. The capacitors in the low output

impedance terminal can stress the device. Pay attention to the electro static voltages during IC handling,

transportation, and storage.

12) Output capacitor

When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the

external capacitor, connected to output terminal, accumulated charge may be discharged VCC terminal via

the parasitic element within the circuit or terminal protection element. The element in the circuit may be

damaged (thermal destruction). When using this IC for an application circuit where there is oscillation, output

capacitor load does not occur, as when using this IC as a voltage comparator. Set the capacitor connected to

output terminal below 0.1μF in order to prevent damage to IC.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation

version only for a reference to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

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© 2012 ROHM Co., Ltd. All rights reserved.

TSZ22111･15･00

16/18

TSZ02201-0RAR1G200060-1-2

9.NOV.2012 Rev.001

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