AT24C04B-PU Просмотр технического описания (PDF) - Atmel Corporation

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AT24C04B-PU

Two-wire Serial EEPROM 4K (512 x 8) 8K (1024 x 8)

Atmel Corporation 

10. AT24C08B Ordering Information

Table 6. Ordering Information

Ordering Code

AT24C08B-PU

(Bulk form only)

AT24C08BN-SH-B (1) (NiPdAu Lead Finish)

AT24C08BN-SH-T (2) (NiPdAu Lead Finish)

AT24C08B-TH-B(1) (NiPdAu Lead Finish)

AT24C08B-TH-T(2) (NiPdAu Lead Finish)

AT24C08BY6-YH-T(2) (NiPdAu Lead Finish)

AT24C08B-TSU-T(2)

AT24C08BU3-UU-T(2)

AT24C08B-W-11(3)

Voltage

1.8

1.8

1.8

1.8

1.8

1.8

1.8

1.8

1.8

Package

8P3

8S1

8S1

8A2

8A2

8Y6

5TS1

8U3-1

Die Sale

Operational range

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

Industrial Temperature (-40°C to 85°C)

Note:

1. “-B” denotes bulk.

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K

per reel.

3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial

Interface Marketing.

8P3

8S1

8A2

8Y6

5TS1

8U3-1

-1.8

Package Type

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Array Package (dBGA2)

Options

Low-voltage (1.8V to 5.5V)

14 AT24C04B/08B

5226G–SEEPR–11/09

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