HT1330
Pad Assignment
Pad Coordinates
Unit: mil
S3 1
S2 2
S1 3
VEE 4
CAP2 5
CAP1 6
COM 1 7
29 28
27 26
25 24
(0 ,0 )
8
9 10 11 12 13 14 15 16 17 18
23
22 B U S Y
21 O S C 2
20 O S C 1
19
Pad
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
XY
-62.7 58.7
-62.7 48.7
-62.7 30.1
-62.7 17.2
-62.7 7.3
-62.7 -18.7
-62.7 -58.7
-52.7 -58.7
-42.7 -58.7
-32.7 -58.7
-22.7 -58.7
-12.7 -58.7
-2.7 -58.7
7.3 -58.7
17.3 -58.7
Chip size: 119 ´ 112 (mil)2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Pad
No.
16
17
18
19
20
21
22
23
24
25
26
27
28
29
XY
27.3 -58.7
37.3 -58.7
47.3 -58.7
58.3 -58.7
62.7 -38.8
62.7 -23.7
62.7 48.6
62.7 58.7
43.8 58.7
33.8 58.7
5.8 58.7
-4.3 58.7
-38.6 58.7
-48.6 58.7
Operational Sequence
P ow eron
R e a l T im e S e ttin g
S3
S 3 > 5sec
R e a l T im e
S 1 /S 2
C o u n t-d o w n
T im e S e ttin g
S 1 orS 2
U p /D o w n T im e r
S3
S3
S 1 /S 2 /S 3
S 1 /S 2
C o u n t- d o w n T im e r
C o u n t- u p T im e r
S 1 /S 2 o r S 1 /S 2 /S 3
S 1 /S 2 o r S 1 /S 2 /S 3
Note: S1 for Hour setting
S2 for Minute setting
S3 to Start/Stop the timer
S3>5 seconds into the real time setting mode
S1/S2 to reset the timer to the initial state (0:00)
S1/S2/S3 to return to the real time mode
2
August 10, 2000