APL5316(2008) Просмотр технического описания (PDF) - Anpec Electronics
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APL5316 Datasheet PDF : 15 Pages
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APL5316
Simplified Application Circuits
VIN
CIN
APL5316
1 VIN
VOUT 5
3 SHDN POK 4
GND
2
POK
R1
VOUT
COUT
VIN
VIN
CIN
APL5316
1
VIN
VOUT 5
3 SHDN POK 4
GND
2
R1
POK
VOUT
COUT
Absolute Maximum Ratings
Symbol
VIN
VSHDN
PD
TJ
TSTG
TSDR
Parameter
VIN Supply Voltage (VIN to GND)
SHDN Input Voltage (SHDN to GND)
Power Dissipation
Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
Rating
-0.3 ~ 6.5
-0.3 ~ 6.5
Internally Limited
-40 ~ 150
-65 ~ 150
260
Thermal Characteristics
Symbol
Parameter
Typical Value
θJA
Thermal Resistance-Junction to Ambient (Note 1)
240
θJC
Thermal Resistance- Junction to Case
130
Note 1 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions
Symbol
VIN
VOUT
IOUT
COUT
TJ
VIN Supply Voltage
Output Voltage
VOUT Output Current
Output Capacitor
Junction Temperature
Parameter
Range
2.8 ~ 6
Fixed Voltage
0 ~ 300
1.5 ~ 22
-40 ~ 125
Unit
V
V
W
°C
°C
°C
Unit
oC/W
oC/W
Unit
V
V
mA
µF
oC
Copyright © ANPEC Electronics Corp.
2
Rev. A.2 - Aug, 2008
www.anpec.com.tw
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