APA2177 Просмотр технического описания (PDF) - Anpec Electronics

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производитель

APA2177

25mW Stereo Cap-Free Headphone Driver

Anpec Electronics 

APA2177

Application Information

Layout Recommendation

16 x Φ0.25mm

Recommended Minimum Footprint

0.3mm

1mm

Thermal Via

Diameter

0.3mm X 5

0.4mm

0.5mm

1.55mm

Ground

Plane for

Thermal

PAD

0.4mm

Figure : TQFN3x3-16 Layout Recommendation

Figure : WLCSP-16 land pattern recommendation

1. All components should be placed close to the APA2177.

For example, the input capacitor (CiR, CiL) should be

close to APA2177 input pins to avoid causing noise

coupling to APA2177 high impedance inputs; the

decoupling capacitor (CS) should be placed by the

APA2177 power pin to decouple the power rail noise.

2. The output traces should be short, wide (>50mil), and

symmetric.

3. The input trace should be short and symmetric.

4. The power trace width should be greater than 50mil.

5. The input trace and output trace should be away from

CCPF and CCPB possible.

Copyright © ANPEC Electronics Corp.

15

Rev. A.3 - Nov., 2017

www.anpec.com.tw

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