AP2213M-3.0TRE1 Просмотр технического описания (PDF) - BCD Semiconductor
Номер в каталоге
Компоненты Описание
производитель
AP2213M-3.0TRE1 Datasheet PDF : 22 Pages
| |||
500mA LOW NOISE LDO REGULATOR
Application Information
Input Capacitor
A 1µF minimum capacitor is recommended to be
placed between VIN and GND.
Output Capacitor
It is required to prevent oscillation. 1µF minimum is
recommended when CBYP is unused. 2.2µF mini-
mum is recommended when CBYP is 100pF. The out-
put capacitor may be increased to improve transient
response.
Noise Bypass Capacitor
Bypass capacitor is connected to the internal voltage
reference. A 100pF capacitor connected from BYP to
GND make this reference quiet, resulting in a
significant reduction in output noise, but the ESR
stable area will be narrowed.
The start-up speed of the AP2213 is inversely
proportional to the value of reference bypass
capacitor. In some cases, if output noise is not a
major concern and rapid turn-on is necessary, omit
CBYP and leave BYP open.
Power Dissipation
Thermal shutdown may take place if exceeding the
maximum power dissipation in application. Under all
possible operating conditions, the junction tempera-
ture must be within the range specified under abso-
lute maximum ratings to avoid thermal shutdown.
Data Sheet
AP2213
To determine if the power dissipated in the regulator
reaches the maximum power dissipation (see figure
16, 17), using:
TJ = PD*θJA + TA
PD=(VIN-VOUT)*IOUT+VIN*IGND
Where: TJ≤TJ(max), TJ(max) is absolute maximum rat-
ings for the junction temperature; VIN*IGND can be
ignored due to its small value.
TJ(max) is 150oC, θJA is 90oC/W for TO-252-2 (1)
package and 160oC/W for SOIC-8 package.
Example: For 2.5V version packaged in SOIC-8,
IOUT=500mA, TA=50oC, VIN(Max) is:
(150oC-50oC)/(0.5A*160oC/W)+2.5V=3.75V
Therefore, for good performance, please make sure
that input voltage is less than 3.75V without heatsink
when TA=50oC.
Nov. 2009 Rev. 1. 5
BCD Semiconductor Manufacturing Limited
18
Share Link: 