[4] Englemaier, Werner, “Voids in solder
joints-reliability,” Global SMT & Package,
December 2005
[5] IPC Solder Products Value Council,
“Round Robin Testing and Analysis of
Lead Free Solder Pastes with Alloys of Tin,
Silver and Copper,” 2005
[6] IPC-A-610-D, “Acceptance of Electronic
Assemblies,” February 2005
[7] IPC J-STD-001D, “Requirements for
Soldered Electrical and Electronic
Assemblies,”
[8] IPC-SM-7525A, “Stencil Design
Guidelines,” May 2000
[9] JEDEC, JESD22-B102D, “Solderability,”
VA, Sept. 2004
[10]
Syed, Ahmer, et al, “Board Level
Assembly and Reliability Considerations
for QFN Type Packages,” Amkor
Technology, Inc., Chandler, AZ
Applicable FSIDs: FDMF6700, FDMF6704,
FDMF6704A, FDMF6704V, FDMF6730