AH11-G Просмотр технического описания (PDF) - WJ Communications => Triquint

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AH11-G

High Dynamic Range Dual Amplifier

WJ Communications => Triquint 

AH11

High Dynamic Range Dual Amplifier

The Communications Edge TM

Product Information

AH11-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both

lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.

Outline Drawing

Product Marking

The component will be marked with an

“AH11-G” designator with an alphanumeric

lot code on the top surface of the package.

The obsolete tin-lead package is marked with

an “AH11” designator followed by an

alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating:

Value:

Test:

Standard:

Class 1B

Passes from 500 to 1000 V

Human Body Model (HBM)

JEDEC Standard JESD22-A114

ESD Rating:

Value

Test:

Standard:

Class IV

Passes greater than 1000 V

Charge Device Model (CDM)

JEDEC Standard JESD22-C101

MSL Rating: Level 2 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020A

Functional Pin Layout

Land Pattern

Pin Function

1

RF input (Amp1 input)

2

Ground

3

Ground

4

RF input (Amp2 input)

5

RF output (Amp2 output)

6

Ground

7

Ground

8

RF output (Amp1 output)

The backside paddle is the Source and should be

grounded for thermal and electrical purposes.

Mounting Config. Notes

Thermal Specifications

Parameter

Operating Case Temperature

Thermal Resistance, Rth (1)

Junction Temperature, Tj (2)

Rating

1000

-40 to +85 °C

28 °C/W

127 °C

100

Notes:

1. The thermal resistance is referenced from the hottest part 10

of the junction to ground tab underneath the device.

2. This corresponds to the typical biasing condition of +5V,

300 mA at an 85 °C case temperature. A minimum 1

MTTF of 1 million hours is achieved for junction

60

temperatures below 160 °C.

MTTF vs. GND Tab Temperature

70 80 90 100 110

Tab Temperature (°C)

1. Ground / thermal vias are critical for the proper performance

of this device. Vias should use a .35mm (#80/.0135”)

diameter drill and have a final plated through diameter

of .25mm (.010”)

2. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3. To ensure reliable operation, device ground paddle-to-

ground pad solder joint is critical.

4. Add mounting screws near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region

contacts the heatsink.

5. For optimal thermal performance, expose soldermask on

backside where it contacts the heatsink.

6. RF trace width depends upon the PC board material and

construction.

7. Use 1 oz. Copper minimum.

8. If the PCB design rules allow, ground vias should be placed

under the land pattern for better RF and thermal performance.

Otherwise ground vias should be placed as close to the land

pattern as possible.

9. All dimensions are in mm. Angles are in degrees.

Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 5 of 6 May 2006

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