ADF4153BRU(RevA) Просмотр технического описания (PDF) - Analog Devices
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ADF4153BRU Datasheet PDF : 24 Pages
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ADF4153
ABSOLUTE MAXIMUM RATINGS1, 2, 3, 4
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to GND
VDD to VDD
VP to GND
VP to VDD
Digital I/O Voltage to GND
Analog I/O Voltage to GND
REFIN, RFIN to GND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Maximum Junction Temperature
TSSOP θJA Thermal Impedance
LFCSP θJA Thermal Impedance (Paddle Soldered)
LFCSP θJA Thermal Impedance (Paddle Not Soldered)
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared
Rating
−0.3 V to +4 V
−0.3 V to +0.3 V
−0.3 V to +5.8 V
−0.3 V to +5.8 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +85°C
−65°C to +150°C
150°C
150.4°C/W
122°C/W
216°C/W
215°C
220°C
1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 This device is a high performance RF integrated circuit with an ESD rating of < 2 kV, and it is ESD sensitive. Proper precautions should be taken for handling and
assembly.
3 GND = AGND = DGND = 0 V.
4 VDD = AVDD = DVDD = SDVDD.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 6 of 24
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