ADF4153BRU(RevA) Просмотр технического описания (PDF) - Analog Devices
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ADF4153BRU Datasheet PDF : 24 Pages
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ADSP-2181 Interface
Figure 22 shows the interface between the ADF4153 and the
ADSP-21xx digital signal processor. As discussed previously, the
ADF4153 needs a 24-bit serial word for each latch write. The
easiest way to accomplish this using the ADSP-21xx family is to
use the autobuffered transmit mode of operation with alternate
framing. This provides a means for transmitting an entire block
of serial data before an interrupt is generated. Set up the word
length for eight bits and use three memory locations for each
24-bit word. To program each 24-bit latch, store the three 8-bit
bytes, enable the autobuffered mode, and write to the transmit
register of the DSP. This last operation initiates the autobuffer
transfer.
ADSP-21xx
SCLOCK
DT
TFS
I/O FLAGS
ADF4153
SCLK
SDATA
LE
MUXOUT
(LOCK DETECT)
Figure 22. ADSP-21xx to ADF4153 Interface
ADF4153
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-20) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the pad.
This ensures that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
Rev. A | Page 21 of 24
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