ADCMP563BCPZ-RL7(RevD) Просмотр технического описания (PDF) - Analog Devices
Номер в каталоге
Компоненты Описание
производитель
ADCMP563BCPZ-RL7 Datasheet PDF : 15 Pages
| |||
Data Sheet
ADCMP563/ADCMP564
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.23
0.18
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.45
1.30 SQ
1.15
0.50
0.40
9
4
8
5
BOTTOM VIEW
0.25 MIN
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
ORDERING GUIDE
Model1
ADCMP563BRQZ
ADCMP563BCPZ-R2
ADCMP563BCPZ-RL7
ADCMP563BCPZ-WP
ADCMP564BRQZ
EVAL-ADCMP563BRQZ
EVAL-ADCMP564BRQZ
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-21)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead QSOP
16-Lead LFCSP 250 Unit Reel
16-Lead LFCSP 1,500 Unit Reel
16-Lead LFCSP 50 Unit Waffle Pack
20-Lead QSOP
Evaluation Board
Evaluation Board
1 Z = RoHS Compliant Part.
Package Option
RQ-16
CP-16-21
CP-16-21
CP-16-21
RQ-20
Branding
G01
G01
G01
©2007–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04650-0-4/16(D)
Rev. D | Page 15 of 15
Share Link: 