ACPM-7891 Просмотр технического описания (PDF) - HP => Agilent Technologies

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производитель

ACPM-7891

Tri-Band Power Amplifier Module EGSM, DCS and PCS Multi-slot GPRS

HP => Agilent Technologies 

Appendix B

Stencil Design on PCB for

ACPM-7891

In order to dissipate heat, addi-

tional via holes on the PCB are

needed on the printed circuit

board.

Solder mask should not be

applied to thermal/ground plane

underneath the vias in a way that

will reduce heat transfer

efficiency from conductive

paddle to ambient. The stencil

design enables solder paste to fill

up the vias and form a solid

conducting bar that further

improves the thermal dissipation.

0.236 [6.00]

0.2317 [5.52]

0.189 [4.80]

0.142 [3.60]

0.236 [2.40]

0.047 [1.20]

0.000 [0.00]

0.150 [3.82]

0.220 [5.59]

A properly designed solder

screen or stencil is required to

ensure optimum amount of sol-

der paste is deposited onto the

PCB pads. The recommended

stencil layout is shown in Figure

B1. The stencil has a solder paste

deposition opening approxi-

mately 90% of the PCB pad.

Reducing stencil opening of the

conductive paddle potentially

generate void underneath, on the

other hand stencil opening larger

than 100% will lead to excessive

solder paste smear across the

conductive paddle to adjacent

I/O pads.

0.022 [0.56]

0.022 [0.56]

Figure B1. Recommended Stencil.

0.043 [1.09]

0.011 [0.26]

21

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