74HC259 Просмотр технического описания (PDF) - NXP Semiconductors.

Номер в каталоге

Компоненты Описание

производитель

74HC259

8-bit addressable latch

NXP Semiconductors. 

NXP Semiconductors

12. Package outline

DIP16: plastic dual in-line package; 16 leads (300 mil)

74HC259; 74HCT259

8-bit addressable latch

SOT38-4

D

L

Z

e

b

16

pin 1 index

A2 A

A1

wM

b1

b2

9

ME

c

(e 1)

MH

E

1

8

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A

max.

A1

min.

A2

max.

b

b1

b2

c

D (1)

E (1)

e

e1

L

ME

MH

w

Z (1)

max.

mm

4.2

0.51

3.2

1.73

1.30

0.53

0.38

1.25

0.85

0.36 19.50 6.48

0.23 18.55 6.20

2.54

7.62

3.60

3.05

8.25

7.80

10.0

8.3

0.254

0.76

inches 0.17

0.02

0.13

0.068 0.021 0.049 0.014

0.051 0.015 0.033 0.009

0.77

0.73

0.26

0.24

0.1

0.3

0.14

0.12

0.32

0.31

0.39

0.33

0.01

0.03

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

IEC

SOT38-4

REFERENCES

JEDEC

JEITA

EUROPEAN

PROJECTION

ISSUE DATE

95-01-14

03-02-13

Fig 13. Package outline SOT38-4 (DIP16)

74HC_HCT259_4

Product data sheet

Rev. 04 — 25 February 2009

© NXP B.V. 2009. All rights reserved.

14 of 21

Share Link: