CXD2931R Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXD2931R

1 chip GPS LSI

Sony Semiconductor 

Package Outline

Unit: mm

108

109

144PIN LQFP (PLASTIC)

22.0 ± 0.2

1.7 MAX

20.0 ± 0.1

73

1.4 ± 0.1

72

CXD2931R

B

144

1 0.5

0.1 ± 0.05

A

37

b

b = 0.22 ± 0.05

(0.2)

36

0.08 M S

S

b = 0.20 ± 0.03

0.1 S

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

DETAIL B : SOLDER

DETAIL B : PALLADIUM

LQFP-144P-L01

LQFP144-P-2020

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

42/COPPER ALLOY

PACKAGE MASS

1.3 g

– 23 –

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