MFRC52201HN1 Просмотр технического описания (PDF) - NXP Semiconductors.
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MFRC52201HN1 Datasheet PDF : 95 Pages
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NXP Semiconductors
17. Package outline
MFRC522
Standard performance MIFARE and NTAG frontend
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
SOT617-1
D
BA
terminal 1
index area
A
A1
E
c
detail X
e1
C
e
1/2 e b
vMC A B
y1 C
y
9
16
wM C
L
17
8
e
Eh
e2
1/2 e
1
24
terminal 1
index area
32
25
Dh
X
0
2.5
5 mm
DIMENSIONS (mm are the original dimensions)
scale
UNIT A(1)
max.
A1
b
c
D(1) Dh E(1) Eh
e
e1 e2 L
v
w
y y1
mm
1
0.05 0.30
0.00 0.18
0.2
5.1
4.9
3.25
2.95
5.1
4.9
3.25
2.95
0.5
3.5 3.5
0.5
0.3
0.1 0.05 0.05 0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT617-1
---
MO-220
---
ISSUE DATE
01-08-08
02-10-18
Fig 33. Package outline SOT617-1 (HVQFN32)
MFRC522
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.9 — 27 April 2016
112139
© NXP Semiconductors N.V. 2016. All rights reserved.
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