SAMA5D3(2013) Просмотр технического описания (PDF) - Atmel Corporation

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Компоненты Описание

производитель

SAMA5D3
(Rev.:2013)

ARM-based Embedded MPU

Atmel Corporation 

5. Mechanical Characteristics

Figure 5-1. 324-ball LFBGA Package Drawing

TITLE

Low Profile Fine Pitch Ball Grid Array

324

Table 5-1. 324-ball LFBGA Package Characteristics

Moisture Sensitivity Level

3

Table 5-2. Device and 324-ball LFBGA Package Maximum Weight

400

mg

Table 5-3. Package Reference

JEDEC Drawing Reference

JESD97 Classification

MO-275-KAAE-1

e8

Table 5-4. Package Information

Ball Land

Solder Mask Opening

Solder Mask Definition

0.350 mm ± 0.05

0.275 mm ± 0.05

SMD

SAMA5D3 Series [SUMMARY DATASHEET] 19

11121AS–ATARM–31-Jan-13

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