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AD7609 Просмотр технического описания (PDF) - Analog Devices

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AD7609 Datasheet PDF : 36 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
AVCC to AGND
VDRIVE to AGND
Analog Input Voltage to AGND1
Digital Input Voltage to AGND
Digital Output Voltage to AGND
REFIN to AGND
Input Current to Any Pin Except
Supplies1
Operating Temperature Range
B Version
Storage Temperature Range
Junction Temperature
Pb/SN Temperature, Soldering
Reflow (10 sec to 30 sec)
Pb-Free Temperature, Soldering Reflow
ESD (All Pins Except Analog Inputs)
ESD (Analog Input Pins Only)
Rating
−0.3 V to +7 V
−0.3 V to AVCC + 0.3 V
±16.5 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to AVCC + 0.3 V
±10 mA
−40°C to +85°C
−65°C to +150°C
150°C
240(+0)°C
260(+0)°C
2 kV
7 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
AD7609
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION
Rev. B | Page 11 of 36

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