UPD16430AGF-3B9 Просмотр технического описания (PDF) - NEC => Renesas Technology

Номер в каталоге

Компоненты Описание

производитель

UPD16430AGF-3B9

1/2, 1/3, 1/4 DUTY LCD CONTROLLER/DRIVER

NEC => Renesas Technology 

Characteristic Curves

200 k

fOSC - R Characteristics

VDD = +5 V

Ta = +25 °C

100 k

µPD16430A

100 k

fOSC - VDD, Ta Characteristics

R = 100 kΩ

VDD = 5.5 V

VDD = 5.0 V

VDD = 4.5 V

VDD = 3.5 V

10 k

0

100 k 200 k 300 k 400 k 500 k

External resistor R (Ω)

–40

25

85

Temperature Ta (°C)

Recommended Soldering Conditions

When soldering on this product, please observe the recommended conditions indicated in the table below.

If planning to solder under different conditions, please consult an NEC sales representative.

µPD16430AGF-3B9

Soldering method

Infrared ray reflow

VPS

Wave soldering

Partial heating

Soldering conditions

Peak package temperature: 235 °C, time: 30 seconds max. (210 °C min.),

number of reflow processes: 2, exposure limit: none Note

Peak package temperature: 215 °C, time: 40 seconds max. (200 °C min.),

number of reflow processes: 2, exposure limit: none Note

Solder temperature: 260 °C max., time: 10 seconds max.

number of reflow processes: 1, exposure limit: none Note

Pin temperature: 300 °C max., time: 10 seconds max., exposure limit: none Note

Symbol

IR35-00-2

VP15-00-2

WS60-00-1

Note Exposure limit before soldering after dry-package is opened.

Storage conditions: 25 °C, relative humidity of 65 % or less.

Caution Do not apply two or more soldering methods (except partial heating) in combination.

21

Share Link: