SEMiX 302GB12T4s
SEMiX®2s
Trench IGBT Modules
Characteristics
Symbol Conditions
Inverse Diode
C
C.
C
622<
G
6C ;.. "? 3 .
6C ;.. "
#I# 8;.. "IB
- () * ,
- '). * ,
- () *
- '). *
- () *
- '). *
- '). *
3 D') ? 9..
2-D/
Module
##
min.
typ.
(4')
(4.)
'4;
.4=
(4:
;4:
(;.
).
'=
max. Units
(48)
(48
'4)
'4'
;4(
5
84;
5
"
B
J
.4'7 LI&
SEMiX 302GB12T4s
SEMiX 302GAL12T4s
SEMiX 302GAR12T4s
Target Data
Features
!
Typical Applications
M
2NEN
,4 D
() *
'() *
2D
#
<
O <)
<
<9
Temperature sensor
2'..
K'..I'()
'..* 2()) O5
22'.. +RK'..I'()'ID'I'..S?
RLS
':
.47
5
'
5
.4.8)
LI&
;
)
P
(4)
)
P
().
.48=;>)Q
O5
;)).>(Q
L
" #
$%
& #
Remarks
#
'()* +,
%# ! #
-').*
/
! 0
234.4)54
23 4.4)54
234+(4(5 4
24+.4)5
This is an electrostatic discharge sensitive device (ESDS), international standard
IEC 60747-1, Chapter IX.
This technical information specifies semiconductor devices but promises no
characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability.
GB
GAL
GAR
2
26-07-2007 SCH
© by SEMIKRON