70FL256P0XBHI20 Просмотр технического описания (PDF) - Spansion Inc.

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производитель

70FL256P0XBHI20

256-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus

Spansion Inc. 

Data Sheet

6. Device Operations

6.1 Programming

Each Flash die must be programmed independently due to the nature of the dual die stack.

6.2 Simultaneous Die Operation

The user may only access one Flash die of the dual die stack at a time via its respective Chip Select.

6.3 Sequential Reads

Sequential reads are not supported across the end of the first Flash die to the beginning of the second. If the

user desires to sequentially read across the two die, data must be read out of the first die via CS1# and then

read out of the second die via CS2#.

6.4 Sector/Bulk Erase

A sector erase command must be issued for sectors in each Flash die separately. Full device Bulk Erase via

a single command is not supported due to the nature of the dual die stack. A Bulk Erase command must be

issued for each die.

6.5 Status Register

Each Flash die of the dual die stack is managed by its own Status Register. Reads and updates to the Status

Registers must be managed separately. It is recommended that Status Register control bit settings of each

die are kept identical to maintain consistency when switching between die.

6.6 Configuration Register

Each Flash die of the dual die stack is managed by its own Configuration Register. Updates to the

Configuration Register control bits must be managed separately. It is recommended that Configuration

Register control bit settings of each die are kept identical to maintain consistency when switching between

die.

6.7

Block Protection

Each Flash die of the dual die stack will maintain its own Block Protection. Updates to the TBPROT and

BPNV bits of each die must be managed separately. By default, each die is configured to be protected

starting at the top (highest address) of each array, but no address range is protected. It is recommended that

the Block Protection settings of each die are kept identical to maintain consistency when switching between

die.

7. Read Identification (RDID)

The Read Identification (RDID) command outputs the one-byte manufacturer identification, followed by the

two-byte device identification and the bytes for the Common Flash Interface (CFI) tables. Each die of the

FL256P dual die stack will have identical identification data as the FL129P die, with the exception of the CFI

data at byte 27h, as shown in Table 7.1.

Table 7.1 Product Group CFI Device Geometry Definition

Byte

27h

Data

19h

Description

Device Size = 2^N byte

June 24, 2011 S70FL256P_00_04

S70FL256P

11

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