NLSX3018MUTAG(2013) Просмотр технического описания (PDF) - ON Semiconductor
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NLSX3018MUTAG Datasheet PDF : 12 Pages
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NLSX3018
PACKAGE DIMENSIONS
2X
0.15 C
PIN 1
REFERENCE
2X
0.15 C
0.10 C
20X 0.08 C
1
D
TOP VIEW
SIDE VIEW
DETAIL A
UDFN20 4x2, 0.4P
CASE 517AK
ISSUE O
AB
L1
E
DETAIL A
NOTE 5
(A3)
A
A1
C
SEATING
PLANE
19X L
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NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D
4.00 BSC
E
2.00 BSC
e
0.40 BSC
L 0.50 0.60
L1 0.00 0.03
L2 0.60 0.70
(L2)
20
e
e/2
BOTTOM VIEW
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20X b
0.10 M
0.05 M
CAB
C NOTE 3
MOUNTING FOOTPRINT*
SOLDERMASK DEFINED
20X
0.22
19X
0.78
2.30
0.88
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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