MF1PLUS6001DA4/03 Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

производитель

MF1PLUS6001DA4/03

Mainstream contactless smart card IC for fast and easy solution development

NXP Semiconductors. 

NXP Semiconductors

MF1PLUSx0y1

Mainstream contactless smart card IC

16. Tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Quick reference data . . . . . . . . . . . . . . . . . . . . .2

Ordering information . . . . . . . . . . . . . . . . . . . . .3

Bonding pad assignments to smart card

contactless module . . . . . . . . . . . . . . . . . . . . . . .5

ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . 11

ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . .12

Security level 0 command overview . . . . . . . . .12

Table 7. Security level 1 command overview. . . . . . . . . 12

Table 8. Security level 2 command overview. . . . . . . . . 13

Table 9. Security level 3 command overview . . . . . . . . 13

Table 10. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 11. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 12. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16

17. Figures

Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Fig 2. Contact assignments for SOT500-2 (MOA4) . . . . .5

Fig 3. Memory organization . . . . . . . . . . . . . . . . . . . . . . .6

MF1PLUSX0Y1_SDS

Product short data sheet

PUBLIC

All information provided in this document is subject to legal disclaimers.

Rev. 3.2 — 21 February 2011

163532

© NXP B.V. 2011. All rights reserved.

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