MAX8969EWL50(2011) Просмотр технического описания (PDF) - Maxim Integrated
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MAX8969EWL50 Datasheet PDF : 15 Pages
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Step-Up Converter
for Handheld Applications
ABSOLUTE MAXIMUM RATINGS
IN, OUT_ to GND_................................................-0.3V to +6.0V
EN, TREN to GND_............. -0.3V to lower of (VIN + 0.3V) or 6V
Total LX_ Current........................................................... 3.2ARMS
OUT_ Short Circuit to GND_......................................Continuous
Continuous Power Dissipation (TA = +70NC)
WLP (derate 12mW/NC above +70NC).........................960mW
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow) (Note 1).........................+260NC
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the
device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder pro-
files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
WLP
Junction-to-Ambient Thermal Resistance (BJA)...........83NC/W
Junction-to-Case Thermal Resistance (BJC)................50NC/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VIN = 2.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are TA = +25NC.) (Note 3)
PARAMETER
Operating Input Voltage Range
Minimum Startup Voltage
CONDITIONS
MIN
2.5
Undervoltage Lockout Threshold (UVLO) VIN falling, 75mV hysteresis
2.1
Shutdown Supply Current
Thermal Shutdown
VEN = VTREN = VOUT = 0V,
VIN = 4.8V
TA rising, 20NC hysteresis
TA = +25NC
TA = +85NC
BOOST MODE
Continuous Output Current
VIN > 2.5V (Note 4)
1
VOUT = 3.3V
0.9
VOUT = 3.5V
0.8
Peak Output Current
VIN > 2.5V, pulse
VOUT = 3.7V
0.7
load
VOUT = 4.25V
0.7
VOUT = 4.7V
0.7
VOUT = 5.0V
0.7
Switching Frequency
(Note 4)
Output Voltage Accuracy
No load, VOUT_TARGET = 3.3V
No load, VOUT_TARGET = 3.5V
No load, VOUT_TARGET = 3.7V
No load, VOUT_TARGET = 4.25V
No load, VOUT_TARGET = 5V
3.175
3.40
3.64
4.10
4.85
TYP
2.3
2.2
0.8
1
+165
3
3.30
3.50
3.75
4.25
5.00
MAX
5.5
2.3
5
3.40
3.60
3.85
4.35
5.10
UNITS
V
V
V
FA
NC
A
A
MHz
V
2 _______________________________________________________________________________________
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