LSM330DL Просмотр технического описания (PDF) - STMicroelectronics

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производитель

LSM330DL

Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

STMicroelectronics 

Application hints

LSM330DL

The functions, the threshold and the timing of the two interrupt pins for each sensor can be

completely programmed by the user though the SPI/I2C interface.

4.2

Soldering information

The LGA package is compliant with the ECOPACK®, RoHS and “Green” standards.

It is qualified for soldering heat resistance according to JEDEC J-STD-020D.

Leave “Pin 1 Indicator” unconnected during soldering.

The landing pattern and soldering recommendations are available at www.st.com/mems.

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Doc ID 022018 Rev 1

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