FBGA DEVICE MARKING
Due to the size of the package, Micron’s standard
part number is not printed on the top of each device.
Instead, an abbreviated device mark comprised of a
five-digit alphanumeric code is used. The abbreviated
device marks are cross referenced to Micron part num-
bers in Table 1.
DBFCF
Speed Grade
B = -10
C = -8
ADVANCE
256Mb: x16
MOBILE SDRAM
Width ( I/Os)
D = x16
Device Density
H = 256
Product Type
R = 2.5V SDR SDRAM, Low Power version (54-ball, 8 x 14)
S = 1.8V SDR SDRAM, Low Power version (54-ball, 8 x 14)
Product Group
D = DRAM
Z = DRAM ENGINEERING SAMPLE
PART NUMBER
MT48V16M16LFFG-8
MT48V16M16LFFG-10
MT48V16M16LFFG-10
MT48H16M16LFF-8
CROSS REFERENCE FOR FBGA DEVICE MARKING
ARCHITECTURE
16 Meg x 16
16 Meg x 16
16 Meg x 16
16 Meg x 16
FBGA
54-ball, 8 x 14
54-ball, 8 x 14
54-ball, 8 x 14
54-ball, 8 x 14
ENGINEERING
SAMPLE
ZSHDC
ZRHDB
ZSHDB
ZRHDC
PRODUCTION
MARKING
DSHDC
DRHDB
DSHDB
DRHDC
DATA SHEET DESIGNATION
Advance: This data sheet contains initial descriptions of products still under development.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
256Mb: x16 Mobile SDRAM
MobileRamY26L_A.p65 – Pub. 5/02
58
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.