BA6901F Просмотр технического описания (PDF) - ROHM Semiconductor

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BA6901F

Two-phase Full-wave DC Brushless Fan Motor Drivers

ROHM Semiconductor 

BA6901F

Datasheet

●Power dissipation

Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is

heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The

temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable

power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)

and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to

the maximum value in the storage temperature range.

Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which

indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θ

ja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.19 shows the model of

heat resistance of the package.

Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the

equation below:

θja = (Tj – Ta) / P [°C/W]

Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can

be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance

θja.

Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,

wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at

a specified condition. Fig.20 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70

[mm] x 1.6 [mm] (copper foil area below 3 [%]))

Pd(mW)

800

700

625

600

θja = (Tj – Ta) / P [°C/W]

560

500

Ambient temperature Ta[°C]

400

Package surface temperature Tc[°C]

300

200

BA6901F

100

Chip surface temperature Tj[°C]

Power consumption P[W]

Fig.19 Thermal resistance

0

25 50 75 95 100 125 150 Ta(℃)

*Reduce by 5.0mW/°C over 25°C

(On 70.0mm x 70.0mm x 1.6mm glass epoxy board)

Fig.20 Thermal de-rating curve

●I/O equivalence circuit(Resistance values are typical)

1) Hall input terminal

2) Current limiting input terminal

Output current detecting terminal

Vcc

Vcc

3) Charge-discharge pulse

output terminal

Vcc

1kΩ

H+ 1kΩ

H-

1kΩ

CS

1kΩ

CL

TOUT

30Ω

30Ω

1kΩ

4) PWM input terminal

Vcc

PWM

30kΩ

100kΩ

1kΩ

GND

5) Output terminal

Vcc

A1, A2

15kΩ

6) Signal output terminal

FG、AL、ALB

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© 2012 ROHM Co., Ltd. All rights reserved.

TSZ22111・15・001

13/17

TSZ02201-0H1H0B100500-1-2

18.DEC.2012 Rev.002

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