TMP47C823F Просмотр технического описания (PDF) - Toshiba

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TMP47C823F

Quality And Reliability Assurance / Handling Precautions

Toshiba 

Quality and Reliability Assurance / Handling Precautions

(3) Make sure that no surge voltages from the measuring equipment are

applied to the device.

(4) The chips housed in tape carrier packages (TCPs) are bare chips and are

therefore exposed. During inspection take care not to crack the chip or

cause any flaws in it.

Electrical contact may also cause a chip to become faulty. Therefore make

sure that nothing comes into electrical contact with the chip.

4.5 Mounting

There are essentially two main types of semiconductor device package: lead

insertion and surface mount. During mounting on printed circuit boards, devices

can become contaminated by flux or damaged by thermal stress from the soldering

process. With surface-mount devices in particular, the most significant problem is

thermal stress from solder reflow, when the entire package is subjected to heat.

This section describes a recommended temperature profile for each mounting

method, as well as general precautions which you should take when mounting

devices on printed circuit boards. Note, however, that even for devices with the

same package type, the appropriate mounting method varies according to the size of

the chip and the size and shape of the lead frame. Therefore, please consult the

relevant technical datasheet or databook.

4.5.1

Lead Forming

x Always wear protective glasses when cutting the leads of a device

with clippers or a similar tool. If you do not, small bits of metal

flying off the cut ends may damage your eyes.

y Do not touch the tips of device leads. Because some types of device

have leads with pointed tips, you may prick your finger.

Semiconductor devices must undergo a process in which the leads are cut and

formed before the devices can be mounted on a printed circuit board. If undue

stress is applied to the interior of a device during this process, mechanical

breakdown or performance degradation can result. This is attributable

primarily to differences between the stress on the device’s external leads and

the stress on the internal leads. If the relative difference is great enough, the

device’s internal leads, adhesive properties or sealant can be damaged.

Observe these precautions during the lead-forming process (this does not

apply to surface-mount devices):

(1) Lead insertion hole intervals on the printed circuit board should match

the lead pitch of the device precisely.

(2) If lead insertion hole intervals on the printed circuit board do not

precisely match the lead pitch of the device, do not attempt to forcibly

insert devices by pressing on them or by pulling on their leads.

030901

QUA-41

2002-02-20

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