TMP86C829AU Просмотр технического описания (PDF) - Toshiba

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TMP86C829AU

Quality And Reliability Assurance / Handling Precautions

Toshiba 

Quality and Reliability Assurance / Handling Precautions

Table 2.8 Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (3/3)

Products

Name

Package no.

Air reflow

Infrared reflow

TMP47C660AF

P-QFP64-1420-1.00A

TMP47C860AF

P-QFP64-1420-1.00A

TMP47P860VF

P-QFP64-1420-1.00A

TMP47C1220F

P-QFP80-1420-0.80B

TMP47C1620F

P-QFP80-1420-0.80B

TMP47P1620VF

P-QFP80-1420-0.80B

TMP47C1260F

P-QFP64-1420-1.00A

TMP47C1660F

P-QFP64-1420-1.00A

TMP47P1660VF

P-QFP64-1420-1.00A

Note 1: As of March, 2001

A(168h)

A(168h)

G

A(168h)

A(168h)

B(72h)

A(168h)

A(168h)

B(72h)

A(168h)

A(168h)

G

A(168h)

A(168h)

B(72h)

A(168h)

A(168h)

B(72h)

Note 2:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device. For

details of these conditions, please refer to Table 2.2.

030901

QUA-21

2002-02-20

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