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TMP47C823F Просмотр технического описания (PDF) - Toshiba

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TMP47C823F Datasheet PDF : 48 Pages
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Quality and Reliability Assurance / Handling Precautions
(5) 870/X Series
Table 2.7 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
Air reflow
Infrared reflow
TMP88CK48F
P-QFP64-1420-1.00A
TMP88CM48F
P-QFP64-1420-1.00A
TMP88CS48AF P-QFP64-1420-1.00A
TMP88CK49F
P-QFP64-1420-1.00A
TMP88CM49F
P-QFP64-1420-1.00A
TMP88PS49F
P-QFP64-1420-1.00A
TMP88C060F
P-LQFP80-1212-0.50A
TMP88CU74F
P-QFP80-1420-0.80B
TMP88PU74F
P-QFP80-1420-0.80B
TMP88CP76F
P-QFP80-1420-0.80B
TMP88CS76F
P-QFP80-1420-0.80B
TMP88PS76F
P-QFP80-1420-0.80B
TMP88CP77F
P-QFP100-1420-0.65A
TMP88CS77F
P-QFP100-1420-0.65A
TMP88PU77F
P-QFP100-1420-0.65A
Note 1: As of March, 2001
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
B(72h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
B(72h)
A(168h)
B(72h)
Note 2:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
030901
QUA-18
2002-02-20

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