TEA1532 Просмотр технического описания (PDF) - Philips Electronics

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Компоненты Описание

производитель

TEA1532

GreenChip™II SMPS control IC

Philips Electronics 

Philips Semiconductors

13. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

TEA1532

GreenChip™II SMPS control IC

SOT96-1

D

y

Z

8

c

5

E

A

X

HE

vM A

pin 1 index

1

e

A2

A1

4

bp

wM

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1

A2

A3

bp

c

D(1) E(2)

e

HE

L

Lp

Q

v

w

y

Z (1)

θ

mm

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

1.0

0.4

0.7

0.6

0.25 0.25

0.1

0.7

0.3

8o

inches

0.069

0.010

0.004

0.057

0.049

0.01

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.05

0.244

0.228

0.041

0.039

0.016

0.028

0.024

0.01

0.01

0.004

0.028

0.012

0o

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

SOT96-1

IEC

076E03

REFERENCES

JEDEC

JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-18

Fig 14. Package outline.

9397 750 13113

Preliminary data sheet

Rev. 01 — 28 May 2004

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

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