MCRF450 Просмотр технического описания (PDF) - Microchip Technology
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MCRF450 Datasheet PDF : 50 Pages
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MCRF450/451/452/455
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature Package
Range
Device:
MCRF450:
MCRF450/7M:
MCRF451:
MCRF452:
MCRF455:
13.56 MHz Anti-collision Read/Write
MicroID device w/no internal resonant
capacitor
COB (Chip-On-Board) module with dual
68 pF capacitor
13.56 MHz Anti-collision Read/Write
MicroID device w/100 pF internal
resonant capacitor
13.56 MHz Anti-collision Read/Write
MicroID device w/25 pF internal resonant
capacitor
13.56 MHz Anti-collision Read/Write
MicroID device w/50 pF internal resonant
capacitor
Temperature Range:
= -20°C to +70°C
Package:
WF
WFB
W
WB
S
SB
X/SN
P
= Sawed 8" wafer on frame (8 mil backgrind)
= Bumped, sawed 8" wafer on frame (8 mil
backgrind
= 8" wafer (11 mil backgrind)
= Bumped 8" wafer (8 mil backgrind)
= Dice in waffle pack (8 mil backgrind)
= Bumped die in waffle pack (8 mil backgrind)
= SOIC (150 mil body), 8-lead (rotated pinout)
= PDIP (300 mil body), 8-lead
Examples:
a) MCRF450/W: 13.56 MHz Anti-collision
Read/Write MicroID device, 1 Kbit, no cap, 8"
wafer, 11-mil backgrind.
b) MCRF450/7M: 13.56 MHz Anti-collision
Read/Write MicroID COB (IST IOA2), 1 Kbit,
68 pF dual capacitor between antenna A and B,
antenna B and VSS. Thickness = 0.4 mm.
c) MCRF451/WF: 13.56 MHz Anti-collision
Read/Write MicroID device, 1 Kbit, 100 pF
internal res cap, 8" wafer on frame, 8 mil
backgrind.
d) MCRF451/S: 13.56 MHz Anti-collision
Read/Write MicroID device in waffle pack,
1 Kbit, 100 pF internal res cap, 8-mil
thickness.
e) MCRF452/WFB: 13.56 MHz Anti-collision
Read/Write MicroID bumped device for flip-
chip assembly, 1 Kbit, 50 pF dual (25 pF)
internal res cap, Bumped 8" wafer, 8-mil
backgrind wafer on frame.
f) MCRF455X/SN: 13.56 MHz Anti-collision
Read/Write MicroID device in SOIC package,
1k bit, 50 pF internal res cap.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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2003 Microchip Technology Inc.
DS40232H-page 47
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