MAX3273(2002) Просмотр технического описания (PDF) - Maxim Integrated

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производитель

MAX3273
(Rev.:2002)

+3.3V, 2.5Gbps Low-Power Laser Driver

Maxim Integrated 

+3.3V, 2.5Gbps Low-Power Laser Driver

Interface Models

Figures 4 and 5 show simplified input and output cir-

cuits for the MAX3273 laser driver. If dice are used,

replace package parasitic elements with bondwire par-

asitic elements.

Wire-Bonding Die

For high-current density and reliable operation, the

MAX3273 uses gold metalization. Make connections to

the die with gold wire only, using ball-bonding tech-

niques. Wedge bonding is not recommended. Die-pad

size is 4 mils (100µm) square, and die thickness is 14

mils (350µm).

Layout Considerations

To minimize inductance, keep the connections between

the MAX3273 output pins and laser diode as close as

possible. Optimize the laser-diode performance by

placing a bypass capacitor as close as possible to the

laser anode. Use good high-frequency layout tech-

niques and multilayer boards with uninterrupted ground

planes to minimize EMI and crosstalk.

Laser Safety and IEC 825

Using the MAX3273 laser driver alone does not ensure

that a transmitter design is compliant with IEC 825. The

entire transmitter circuit and component selections

must be considered. Customers must determine the

level of fault tolerance required by their application,

recognizing that Maxim products are not designed or

authorized for use as components in systems intended

for surgical implant into the body, for applications

intended to support or sustain life, or for any other

application where the failure of a Maxim product could

create a situation where personal injury or death may

occur.

Chip Information

TRANSISTOR COUNT: 1672

PROCESS: SiGe

ISOLATED SUBSTRATE

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