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MAX1624-MAX1625 Просмотр технического описания (PDF) - Maxim Integrated

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MAX1624-MAX1625 Datasheet PDF : 24 Pages
First Prev 21 22 23 24
High-Speed Step-Down Controllers with
Synchronous Rectification for CPU Power
Minimize high-current path trace lengths. Use
very short and wide traces. From C1 to N1: 0.4 in.
(10mm) max length; D1 cathode to N2: 0.2 in.
(5mm) max length; LX node (N1 source, N2 drain,
D1 cathode, inductor L1): 0.6 in. (15mm) max
length.
2) Place the MAX1624/MAX1625 and supporting
components following these rules:
Minimize trace lengths to the current-sense
resistor. The IC must be no farther than 0.4 in.
(10mm) from the current-sense resistor. Use a
Kelvin connection.
Minimize ground trace lengths between the
MAX1624/MAX1625 and supporting compo-
nents. Connect components for the REF, CC1,
CC2, and FREQ pin directly to AGND. Connect
AGND and PGND at the IC.
Keep noisy nodes and components away from
sensitive analog nodes, such as the current-
sense, voltage-feedback, REF, CC1, CC2, and
FREQ pins. Placing the IC and analog compo-
nents on the opposite side of the board from the
power-switching node is desirable. Noisy nodes
include the main switching node (LX), inductor,
and gate-drive outputs.
Place components for the FREQ, REF, CC1,
and CC2 pins as close to the IC as possible,
within 0.2 in. (5mm).
• Keep the gate-drive traces (DH, DL, and BST)
shorter than 20mm, and route them away from
CSH, CSL, REF, FB, etc.
• Filter the VCC supply input to the IC. Bypass the
IC directly from VDD to PGND using a 0.1µF
ceramic capacitor and 4.7µF electrolytic capacitor
placed within 0.2 in. (5mm) of the IC.
• Place the voltage-feedback components close to
the FB pin of the MAX1625, within 0.2 in. (5mm).
Connect the voltage-feedback trace directly to the
CPU’s power input and route it to avoid noisy
traces.
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