HMS30C7202N Просмотр технического описания (PDF) - MagnaChip Semiconductor

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HMS30C7202N

Highly-intergrated MPU

MagnaChip Semiconductor 

HMS30C7202N

12.1 ABSOLUTE MAXIMUM RATINGS ......................................................................................................................... 161

12.2 DC CHARACTERISTICS ....................................................................................................................................... 162

12.3 A/D CONVERTER ELECTRICAL CHARACTERISTICS .............................................................................................. 163

12.4 D/A CONVERTER ELECTRICAL CHARACTERISTICS .............................................................................................. 164

12.5 AC CHARACTERISTICS....................................................................................................................................... 165

12.5.1 Static Memory Interface ........................................................................................................................... 165

12.5.1.1 READ Access Timing (Single Mode)..................................................................................................... 165

12.5.1.2 READ Access Timing (Burst Mode) ...................................................................................................... 166

12.5.1.3 WRITE Access Timing ........................................................................................................................... 167

12.5.2 SDRAM Interface...................................................................................................................................... 168

12.5.3 LCD Interface........................................................................................................................................... 169

12.5.4 UART(Universal Asynchronous Receiver Transmitter) ............................................................................ 171

12.6 PACKAGE ........................................................................................................................................................... 172

12.6.1 Recommended Soldering Conditions ........................................................................................................ 172

12.6.1.1 MQFP(Metric Quad Flat Pack ) Type............................................................................................... 172

12.6.1.2 FBGA(Chip Array Ball Grid Array) Type......................................................................................... 172

12.6.2 Pictures of Package Marking ................................................................................................................... 173

13 APPENDIX ......................................................................................................................................................... 174

13.1 DEEP-SLEEP, WAKE-UP ISSUES OF HMS30C7202 PMU...................................................................................... 174

13.1.1 Wake-up .................................................................................................................................................... 174

13.1.2 Deep-sleep ................................................................................................................................................ 174

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