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BSC0908NS Просмотр технического описания (PDF) - Infineon Technologies

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Компоненты Описание
производитель
BSC0908NS
Infineon
Infineon Technologies Infineon
BSC0908NS Datasheet PDF : 12 Pages
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OptiMOSPower-MOSFET
BSC0908NS
2
Maximum ratings
at Tj = 25 °C, unless otherwise specified.
Table 2 Maximum ratings
Parameter
Symbol
Values
Unit Note / Test Condition
Min. Typ. Max.
Continuous drain current
ID
-
-
49
A
VGS=10 V, TC=25 °C
31
VGS=10 V, TC=100 °C
39
VGS=4.5 V, TC=25 °C
25
VGS=4.5 V, TC=100 °C
14
VGS=10 V, TA=25 °C,
RthJA=50 K/W1))
Pulsed drain current2)
ID,pulse
-
-
196
TC=25 °C
Avalanche current, single pulse
IAS
-
-
35
Avalanche energy, single pulse
EAS
-
-
10
mJ ID=30 A,RGS=25 #
Gate source voltage
VGS
-20 -
20
V
Power dissipation
Ptot
-
-
30
W TC=25 °C
2.5
TA=25 °C, RthJA=50 K/W1))
Operating and storage temperature Tj,Tstg
-55 -
150
°C
IEC climatic category; DIN IEC 68-1
55 150 56
Ncm
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection.
PCB is vertical in still air.
2) See figure 3 for more detailed information
3
Thermal characteristics
Table 3 Thermal characteristics
Parameter
Symbol
Min.
Values
Typ.
Max.
Unit Note /
Test Condition
Thermal resistance, junction - case RthJC
-
-
4.2
°K/W bottom
20
top
Device on PCB
RthJA
-
-
50
6 cm2 cooling area1)
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection.
PCB is vertical in still air
Final Data Sheet
2
3.1, 2010-10-18

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