39SF512 Просмотр технического описания (PDF) - Silicon Storage Technology
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39SF512 Datasheet PDF : 22 Pages
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512 Kbit Multi-Purpose Flash
SST39SF512
PACKAGING DIAGRAMS
Data Sheet
Optional
Pin #1
Identifier
.048
.042
TOP VIEW
.495
.485
.453
.447
2 1 32
SIDE VIEW
.020 R.
MAX.
.112
.106
.029
.023
x
30˚
.040
.030
R.
BOTTOM VIEW
.042
.048
.595 .553
.585 .547
.021
.013
.032
.400 .530
.026
BSC .490
.050
BSC
.050
BSC
.015 Min.
.095
.075
.032
.140
.026
.125
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
32-plcc-NH-3
Pin # 1 Identifier
1.05
0.95
0.50
BSC
8.10
0.27
7.90
0.17
12.50
12.30
0.70
0.50
14.20
13.80
1.20
max.
0.15
0.05
DETAIL
Note:
0.70
0.50
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
1mm
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
0˚- 5˚
32-tsop-WH-7
©2003 Silicon Storage Technology, Inc.
21
S71149-05-000
11/03
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