Footprint
BGF125
SIM Card Interface Filter and ESD Protection
BGF125
0.8
0.4
Figure 5
0.25
WLP-8-10-N-FP V02
Recommended PCB pad design for reflow soldering
Tape
4
0.25
1.33
Pin 1
Corner Index Area
0.75
WLP-8-10-N-TP V01
Figure 6 Tape for BGF125 / WLP-8-10
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”:
http://www.infineon.com/products.
Data Sheet
7
V2.0, 2009-04-01