ADCMP603BCPZ-R7(Rev0) Просмотр технического описания (PDF) - Analog Devices

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производитель

ADCMP603BCPZ-R7
(Rev.:Rev0)

Rail-to-Rail, Very Fast, 2.5 V to 5.5 V, Single-Supply TTL/CMOS Comparator

Analog Devices 

ADCMP603

2

OUTLINE DIMENSIONS

3.00

BSC SQ

0.75

0.55

0.60 MAX

0.35

PIN 1

INDICATOR

TOP

VIEW

0.45

2.75

BSC SQ

10

9

11

12 1

8

2

EXPOSED PAD

(BOTTOM VIEW)

7

3

654

12° MAX

1.00

0.85

0.80

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.50

BSC

SEATING

PLANE

0.30

0.23

0.20 REF

COPLANARITY

0.08

0.18

PIN 1

INDICATOR

*1.45

1.30 SQ

1.15

0.25 MIN

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 25. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-12-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

ADCMP603BCPZ-WP1

ADCMP603BCPZ-R21

ADCMP603BCPZ-R71

1 Z = Pb-free part.

Temperature Range

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

Package Description

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

Package Option

CP-12-1

CP-12-1

CP-12-1

Branding

G0D

G0D

G0D

Rev. 0 | Page 14 of 16

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