25Q16BV Просмотр технического описания (PDF) - Winbond
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25Q16BV Datasheet PDF : 68 Pages
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13.5 16-Pin SOIC 300-mil (Package Code SF)
W25Q16BV
GAUGE PLANE
DETAIL A
SYMBOL
A
A1
A2
b
C
D
E
E1
e(2)
L
y
θ
Min
2.36
0.10
---
0.33
0.18
10.08
10.01
7.39
0.38
---
0°
MILLIMETERS
Nom
Max
2.49
2.64
---
0.30
2.31
---
0.41
0.51
0.23
0.28
10.31
10.49
10.31
10.64
7.49
7.59
1.27 BSC.
0.81
1.27
---
0.076
---
8°
Min
0.093
0.004
---
0.013
0.007
0.397
0.394
0.291
0.015
---
0°
INCHES
Nom
0.098
---
0.091
0.016
0.009
0.406
0.406
0.295
0.050 BSC.
0.032
---
---
Max
0.104
0.012
---
0.020
0.011
0.413
0.419
0.299
0.050
0.003
8°
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
- 65 -
Publication Release Date: July 08, 2010
Revision F
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